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BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
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1. Lead-free Solder Paste is a high-performance, no-clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post-weld residue.
2. Strong Adhesion & Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long-term durability.
3. Advanced Membrane Removal Technology: Reduces net scraping frequency during operation, improving workflow efficiency by up to 30%.
4. No-Clean & Eco-Friendly Formula: Leaves very little residue, eliminating post-weld cleaning. High resistance ensures stability in demanding conditions.
5. Particle Size: 35-45 microns
6. Melting Point: 138 degrees Celsius
7. Recommended Temperature: 160–170 degrees Celsius
8. Net Weight: 35g
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